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Multibeam Antennas from Baylin Technologies Enhance Connectivity in Times Square
Pickering Group Opens a New Office in Malaysia to Serve the Expanding Customer Base in Southeast Asia
US Army Awards L3Harris Nearly $300 M for Resilient Communications Program
The U.S. Army has awarded L3Harris Technologies full-rate manpack and leader radio production orders under the Handheld, Manpack & Small Form Fit (HMS) program totaling nearly $300 million.
Pickering Opens New Office in Malaysia to Serve Expanding Customer Needs in Southeast Asia
Pickering Group has opened a new office in Penang, Malaysia, to better serve the needs of its expanding customer base throughout the Southeast Asia region.
New 5G Network to Spark Research, Learning and Innovation Opportunities at German University
A new 5G network backbone for more advanced research initiatives and immersive learning platforms has been deployed at TH Rosenheim in Germany, thanks to a collaboration between Slovenia’s Kontron and Mugler SE.
Celestia TTI Next-Generation UHF Band GaN SSPAs Play Pivotal Role in SpainSat NG I Launch
Next-generation UHF band GaN solid state power amplifiers (SSPAs) developed by Celestia TTI will transmit UHF signals from space to terrestrial users when the SpainSat NG I launches from Cape Canaveral, Fla., on January 29, 2025.
PseudolithIC Inc. Raises $6 M in Seed Funding to Revolutionize Wireless Chips with Proprietary Chiplet Heterogeneous Integration Technology
PseudolithIC Inc announced it has successfully raised $6 million in a seed funding round to enable the company to accelerate the development and commercialization of hybrid semiconductor products which integrate compound semiconductor chiplets into silicon wafers.
FCC Issues Annual Communications Marketplace Report
The FCC has released its 2024 Communications Marketplace Report, assessing competition across voice, video, and data services while mapping out plans to expand access and foster innovation throughout America.
The post FCC Issues Annual Communications Marketplace Report appeared first on In Compliance Magazine.
Introducing A4: The Next Generation Antenna Measurement Software from NSI-MI
Celestia TTI Introduce Next-Gen UHF band GaN SSPAs to Transmit Signals from Geostationary Orbits
Microchip Unveils Next-Generation Low-Noise Chip-Scale Atomic Clock for Aerospace & Defense Applications
Molex Introduces New MMCX Power over Coax Solution with Innovative Full-Locking Mating Mechanism
L3Harris Secures $300 Million U.S. Army Contract for Advanced Communication Systems
StarHub and Nokia Partner on Network API Development to Support 4G/5G in Enterprise Applications
United Monolithic Semiconductors Introduces 3-Stage GaN-on-SiC Power Amplifier from 17 to 21.5 GHz
ATEK Midas Appoints NWN Inc. as Exclusive Technical Representative in North California & Northern Nevada
Anritsu to Exhibit Cutting-Edge PCI-Express® 6.0 and 7.0 Signal Integrity Solutions at DesignCon 2025
Anritsu Company will showcase innovative high speed signal integrity solutions at DesignCon 2025, January 29-30 in Santa Clara, Calif., in booth #907, Exhibit Halls A-D.
Microchip Launches the Next Generation of its Low Noise Chip-Scale Atomic Clock
Microchip Technology announces its second generation low noise chip-scale atomic clock (LN-CSAC), model SA65-LN, in a lower profile height and designed to operate in a wider temperature range, enabling low phase noise and atomic clock stability in demanding conditions.
Wireless Broadband Alliance 6G Report Calls for Greater Industry Collaboration to Achieve Ubiquitous Connectivity
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