Vishay Intertechnology, Inc. announced its new thin film submount platform, designed to support next-generation optical transceivers, RF modules and advanced electronic packaging applications requiring high thermal performance, precision alignment and high frequency signal integrity.
Telefónica España has signed a collaboration agreement with Sateliot to apply 5G NR technology in the space domain.
For the sixth consecutive year, Ericsson has been positioned as the clear leader in Growth and Innovation by Frost & Sullivan’s “Frost Radar™: 5G Network Infrastructure, 2026” report.
Rohde & Schwarz will take part in APEMC 2026, held at the Kuala Lumpur Convention Centre (KLCC), Malaysia, from May 4 to May 7.