STMicroelectronics has introduced STEVAL-25R200SA, which is a ready-to-use kit specially designed for developers looking to add near field communication (NFC) functionality to their products. It is a..

Now available in a vibration-resistant version: Aluminum Electrolytic and Aluminum Hybrid Polymer capacitors from Würth Elektronik.

The post Vibration-resistant Capacitors from Würth Elektronik appeared first on In Compliance Magazine.

Sivers Semiconductors announced that it has signed a contract to develop high performance, low-cost digitizers based on the NXP Layerscape platform for satcom by Intelsat.

All SMT variants of the Aluminum Electrolyte and Aluminum Hybrid Polymer capacitors from Würth Elektronik are now available in an extremely vibration-resistant version on request.

With the SPECTRAN® V6 MOBILE devices, Aaronia is now launching a portable real-time spectrum analyzer series that enables precise and reliable on-site measurements.

According to a newly published report by Dell’Oro Group, the broadband access equipment market is forecasted to grow 0.8 percent on average for the next five years (2024-2029). 

TDK Corporation announces two new additions to its high-voltage contactor portfolio for harsh environments: the HVC43MC with integrated mirror contact and the HVC45 with enhanced short-circuit current handling capability.

The post TDK Presents HVC43MC with an Integrated Mirror Contact and HVC45 for Short-circuit Currents up to 12 kA appeared first on In Compliance Magazine.

President Biden honors 23 pioneering scientists and innovators with prestigious National Medals, recognizing breakthrough contributions to scientific advancement and America's technological competitiveness at White House ceremony.

The post Biden Honors National Medal of Science Recipients appeared first on In Compliance Magazine.

Teledyne Storm Microwave, a renowned provider of high-performance RF/Microwave cables and assemblies, has entered into a global franchise agreement with Richardson RFPD, a subsidiary of Arrow Electro..

To further improve the performance of SHF 78124 A synthesizer series, SHF Communication Technologies is set to release the SHF 78125 A series – a completely redesigned line-up of precision sign..

Omantel, the leading telecommunication services provider in the Sultanate of Oman, has formed a multi-year strategic partnership with Airgain, a global frontrunner in wireless connectivity solutions,..

Vaunix has developed a range of digital attenuator matrices that bring affordability, functionality, reliability and simplicity to the microwave test bench and support unique wireless handover testin..

PseudolithIC, an innovative leader in RF (radio frequency) chipset products, has successfully raised $6 million in a seed funding round. The round was led by Entrada Ventures, with additional investm..

Baylin Technologies installed a cutting-edge multibeam antenna in the heart of New York City's Times Square. The installation was completed in time for the iconic New Year’s Eve 2024 celebr..

Pickering Group, the company with over 50 years of expertise in switching & simulation systems for automated electronics test and verification, has opened a new office in Penang, Malaysia, to bet..

The U.S. Army has awarded L3Harris Technologies full-rate manpack and leader radio production orders under the Handheld, Manpack & Small Form Fit (HMS) program totaling nearly $300 million.

Pickering Group has opened a new office in Penang, Malaysia, to better serve the needs of its expanding customer base throughout the Southeast Asia region. 

A new 5G network backbone for more advanced research initiatives and immersive learning platforms has been deployed at TH Rosenheim in Germany, thanks to a collaboration between Slovenia’s Kontron and Mugler SE.

Next-generation UHF band GaN solid state power amplifiers (SSPAs) developed by Celestia TTI will transmit UHF signals from space to terrestrial users when the SpainSat NG I launches from Cape Canaveral, Fla., on January 29, 2025.

PseudolithIC Inc announced it has successfully raised $6 million in a seed funding round to enable the company to accelerate the development and commercialization of hybrid semiconductor products which integrate compound semiconductor chiplets into silicon wafers.