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Teledyne LeCroy's Austin Lab Designated as a Bluetooth Qualification Test Facility
Hyundai and Samsung Develop Private 5G RedCap Technology for Smarter, More Connected Manufacturing
Grinn, Kyocera AVX, Sony Altair, and Skylo Develop New Narrowband-NTN Reference Design
Anritsu Introduces New Software-based Solution for 5G IoT Chipset and Device Development Testing
Exceed Microwave Unveils High-Performance V-Band Diplexer with 50.2–50.4 GHz Rejection
Common Test & Calibration Uses of a Portable Signal Generator in The Field
This versatile field device generates signals that mimic various sensors to test and calibrate equipment. It helps technicians troubleshoot connections and verify system performance. Portable and battery-powered, it's designed for on-site diagnostic work in industrial environments.
The post Common Test & Calibration Uses of a Portable Signal Generator in The Field appeared first on In Compliance Magazine.
SWISSto12 to Develop Next-Generation SES’s O3b mPOWER Ground Terminals, Enabling Remote Region Connectivity
SWISSto12 has been selected by SES to develop innovative large aperture electronically steered antennas for its customer user terminals for its second generation medium Earth orbit constellation, O3b mPOWER.
MediaTek Expands Cloud-to-Edge Leadership with Next-Generation Connectivity and AI at MWC 2025
At Mobile World Congress 2025, MediaTek is showcasing several key technologies that enable wireless evolution towards 6G, including hybrid computing, a live LEO broadband NR-NTN trial, SBFD, along with the new M90 5G-Advanced modem.
5G Americas Provides Update on Development and Advances in NTN
5G Americas has released a new white paper, “New Developments and Advances in 5G and Non-Terrestrial Networks,” exploring the advancements, opportunities and challenges of integrating NTNs with existing 5G infrastructure.
GlobalFoundries and MIT Collaborate to Advance Research and Innovation on Essential Chips for AI
GlobalFoundries and the MIT announced a new master research agreement to jointly pursue advancements and innovations for enhancing the performance and efficiency of critical semiconductor technologies.
QinetiQ US Receives Navy Delivery Order for RF and Circuit Design Support at Dahlgren
QinetiQ US announced a 12-month, $3.8 million delivery order supporting the Naval Surface Warfare Center Dahlgren Division (NSWCDD) Weapons Control and Integration Division (H10).
Nearly US$1 Billion Dollars Flow into Automotive Radar Startups
According to IDTechEx's latest report, "Automotive Radar Market 2025-2045: Robotaxis & Autonomous Cars," newly established radar startups worldwide have raised nearly US$1.2 billion over the past 12 years.
Emerging Markets Drive Microwave Transmission Revenue Up 7 Percent in 4Q 2024
According to a recently published report from Dell’Oro Group, point-to-point microwave transmission equipment revenue grew 7 percent year-over-year in 4Q 2024.
Paramium Technologies Mass-Produces Satellite Antennas with an Origami-Inspired Design to Solve the Satellite Ground Station Shortage
Paramium Technologies takes inspiration from the ancient art of origami to innovate designs for satellite communication antennas.
Rohde & Schwarz and ELT Group Join Forces to Deliver Cutting-Edge EW Systems for European Navies
Rohde & Schwarz and ELT Group signed a contract to provide EW systems for the German Navy’s F124 project and the Polish Navy’s new Miecznick class multirole frigates.
Rohde & Schwarz Advances AI/ML-Powered Neural Receiver Testing in Collaboration with NVIDIA
Rohde & Schwarz continues to push the boundaries of AI-driven wireless communication research with its latest milestone in neural receiver design and testing.
Compound Semiconductors: Strategic Moves & Collaborations in a Nutshell
According to Yole Group, the compound semiconductor device industry is expected to grow to approximately $25 billion by 2030.
MWC25: Rohde & Schwarz Demonstrates Unique UWB Radar Target Simulation with NXP Trimension™ NCJ29D6 Automotive Solution
NXP Semiconductors and Rohde & Schwarz collaborate to demonstrate a test setup for ultra-wideband (UWB) radar target simulation at the upcoming Mobile World Congress in Barcelona.
Bonding to the Ground Plane
Discover how different standards require various approaches to bonding equipment under test to ground planes. Learn the critical differences between MIL-STD-461, CISPR 25, and ANSI C63.4 that could impact your compliance testing results and save you costly retesting.
The post Bonding to the Ground Plane appeared first on In Compliance Magazine.
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