Qualcomm Technologies, Inc. announced the entry into an agreement to acquire Edge Impulse Inc., which will enhance its offering for developers and expand its leadership in AI capabilities to power AI-enabled products and services across IoT.

Insulated Wire Inc. announced Ward/Davis as their new representative for California.

Kymeta announced it is accepting orders for its Goshawk u8 user terminal, designed specifically for government and global ministry of defense. 

ThinKom Solutions, Inc. is expanding its government and military offerings with the ThinAir® GT Plus terminal. 

IDTechEx's report "In-Cabin Sensing 2025-2035: Technologies, Opportunities, and Markets," explores how integrated in-cabin sensing technologies with software-defined vehicle architectures could shape the future of smart mobility.

Astrum Mobile will operate the very first satellite-to-device (S2D) platform delivering 5G non-terrestrial network (NTN) services.

Intellian Technologies USA, Inc. announced that its ARC-M4 Block 1 (AN/USC-75) is now being manufactured at Intellian’s U.S. headquarters, in Irvine, Calif.

Keysight Technologies, Inc. has collaborated with Samsung and NVIDIA to train artificial intelligence (AI) models for Samsung’s 5G-Advanced and 6G technologies. This enables Samsung to integrat..

Rohde & SchwarzandVIAVI Solutionshave collaborated withAnalog Devicesto showcase the potential of network energy saving (NES) inopen radio access networks (O-RAN). AtMobile World Congress 2025in ..

Taoglas®, a trusted provider of antennas and IoT components, will showcase its latest advancements in GNSS, cellular, and Wi-Fi/Bluetooth active and passive antennas at Embedded World 2025, March..

Cavli Wireless is set to introduce its latest innovation, the LTE Cat 4 CQS325 Smart Module, at Embedded World 2025, one of the largest global trade fairs for embedded technologies. The event, will t..

Quectel Wireless Solutions, a global IoT solutions provider, has announced the QuectelFGM842D and FGM842D-PWi-Fi4 andBluetooth Low Energy (BLE) 5.2modules. The modules feature high-performance ARM968..

Mini-Circuits has introduced the PMA5-123-3W+, a 3.5W MMIC power amplifier designed to deliver high dynamic range and linear power across the 8 to 12 GHz frequency range. This new amplifier offers ne..

The Microwave Product Group will be exhibiting at Satellite 2025 event in Washington, DC from March 11 to 13, 2025. They will be showcasing their latest RF and microwave solutions for mission-critica..

VIAVI Solutions Inc. (VIAVI)has announced that theBattelle RavenStar™Active Antenna System is the first product to be validated under O-RAN and 3GPP test specifications atVALOR™, the VIAV..

Qorvo, a global provider of connectivity and power solutions, has unveiled its newest siliconKu-bandSATCOMbeamformer ICfamily forphased array-based user terminals. These next-generation ICs set a new..

pSemi® Corporation announced the introduction of world’s smallest integrated PA-LNA-SW IoT front-end module (FEM): the PE562212. 

MWC25 Barcelona welcomed 109,000 attendees during a transformative week of industry-shaping launches and impactful collaboration, shining a spotlight on advanced mobile technology and AI.

Leonardo DRS, Inc. announced the delivery of its first next-generation Integrated Voice Communication Systems (IVCS) in support of the U.S. Navy’s Arleigh Burke DDG51-class destroyers.

The Student EMC Hardware Design Competition is back for EMC+SIPI 2025! The Education Committee (EdCom) of the IEEE EMC Society would like to invite students currently enrolled in a college or university at either the Ph.D., graduate, or undergraduate level to submit a method for locating an RF source in the presence of unknown reflections.

The post Student EMC Hardware Competition Returns appeared first on In Compliance Magazine.