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Richardson RFPD, Inc., an Arrow Electronics company, announces its attendance and participation at IMS.

Junkosha chose IMS2025 to announce its MWX161 cabling solution as the ideal cable for connecting with multiport VNAs where space is at a premium.

Insulated Wire will be showing a range of their high performance coaxial and microwave cables, cable assemblies and bulk cables at IMS2025. 

In the realm of electromagnetic compatibility (EMC), grounding and bonding are fundamental practices that ensure the safe and effective operation of electrical systems. Proper grounding and bonding minimize electromagnetic interference (EMI) and enhance the performance, reliability, and safety of electronic devices. This article delves into the principles of grounding and bonding in EMC, explores common practices across various industries, and highlights successful implementations through case studies.

The post Basics of Grounding and Bonding for EMC Compliance appeared first on In Compliance Magazine.

NTD Shielding has announced that they are forming a partnership with Advanced Test Equipment Corporation (ATEC) to offer EMC rentals internationally. This partnership allows ATEC to provide customers in Europe with localized service and support for EMC/RF test chambers, RF solutions, and turnkey systems.

The post Advanced Test Equipment Corporation Partners with NTD Shielding to Provide International EMC Rental Options appeared first on In Compliance Magazine.

Morse Micro announced a partnership with Heltec Automation to accelerate the delivery of Wi-Fi HaLow enabled devices and revolutionize IoT connectivity. 

Werlatone®, Inc. is inviting visitors to IMS2025 to celebrate its 60th year in the RF/microwave industry. 

AMD announced that Nokia has included 5th Gen AMD EPYC™ processors to power the Nokia Cloud Platform, bringing the leadership performance and performance per watt to next-generation telecom infrastructure.

SweGaN AB announces Pontus de Laval has been appointed chairman of the board,  and new board memebers Leif Johansson and Gerry Maguire.

pSemi® Corporation unveiled its latest breakthrough in RF silicon-on-insulator (SOI) platform technology: UltraCMOS+™.

According to a recently published report from Dell’Oro Group, total global revenue for the Broadband Access equipment market decreased to $4.4 B in 1Q 2025, down 8 percent Q/Q but flat year-over-year (Y/Y).