Thales announced that it has delivered the Ku-Band Dual traveling wave tubes (Dual-TWTs) for the ASTRA 1Q satellite ordered by SES. 

Rohde & Schwarz presents the new R&S NRP140TWG(N) thermal power sensor, designed to meet the growing demands of applications in the F-Band utilizing a WR 8 waveguide connector.

RFMW announced a strategic partnership with CoolCAD Electronics to enhance its portfolio of high-power and high-voltage SiC semiconductor devices.

Spectrum Instrumentation presents seven new digitizers that make automated acquisition and analysis of signals in the GHz range easier than ever before. 

Artificial Intelligence (AI) can improve broadband infrastructure investment and contribute to enhanced profits and time-to-market so long as it’s used correctly in the pre-deployment phases of broadband rollout, the WBBA has announced.

Intellian Technologies Inc. and Eutelsat Group announced that the new Enterprise Flat Panels are now available exclusively on Eutelsat’s OneWeb LEO network.

Space42 and Viasat, In signed a Memorandum of Understanding (MoU) to explore ecosystem partnership options for developing a 5G Non-Terrestrial Network (NTN) initiative.

Taoglas® announced the expansion of its TFM series of multi-band GNSS front-end modules.

Qualcomm Technologies, Inc. announced the entry into an agreement to acquire Edge Impulse Inc., which will enhance its offering for developers and expand its leadership in AI capabilities to power AI-enabled products and services across IoT.

Insulated Wire Inc. announced Ward/Davis as their new representative for California.

Kymeta announced it is accepting orders for its Goshawk u8 user terminal, designed specifically for government and global ministry of defense. 

ThinKom Solutions, Inc. is expanding its government and military offerings with the ThinAir® GT Plus terminal. 

IDTechEx's report "In-Cabin Sensing 2025-2035: Technologies, Opportunities, and Markets," explores how integrated in-cabin sensing technologies with software-defined vehicle architectures could shape the future of smart mobility.

Astrum Mobile will operate the very first satellite-to-device (S2D) platform delivering 5G non-terrestrial network (NTN) services.

Intellian Technologies USA, Inc. announced that its ARC-M4 Block 1 (AN/USC-75) is now being manufactured at Intellian’s U.S. headquarters, in Irvine, Calif.

pSemi® Corporation announced the introduction of world’s smallest integrated PA-LNA-SW IoT front-end module (FEM): the PE562212. 

MWC25 Barcelona welcomed 109,000 attendees during a transformative week of industry-shaping launches and impactful collaboration, shining a spotlight on advanced mobile technology and AI.

Leonardo DRS, Inc. announced the delivery of its first next-generation Integrated Voice Communication Systems (IVCS) in support of the U.S. Navy’s Arleigh Burke DDG51-class destroyers.

Hirose has expanded its compact coaxial connector offering with the introduction of three mmWave field replaceable solutions. 

Modelithics® announced the release of the Modelithics COMPLETE+3D Library v25.0 for Ansys® HFSS™, now represents approximately 28,000 components with circuit simulation models and ~7000 components with 3D EM / 3D Brick EM™ models.