A breakthrough in advanced packaging materials has arrived with YINCAE's introduction of TM230D, an innovative 3-in-1 sintering material designed to simplify processing while delivering exceptional thermal and reliability performance for next-generation power electronics and high performance semiconductor applications.
Pickering Interfaces announced Test System Architect, a free online graphical toolset designed to simplify signal path design for electronic test systems, allowing engineers to design, configure and visualize complete test architectures before deployment.
As MWC Barcelona 2026 concludes, here are the highlights from the event, including key onsite moment and major announcements.
At MWC Barcelona 2026, Novocomms Limited and Synergy Design Technology Limited announced plans for a family of plug-and-play Metarray-to-Modem modules utilizing NXP® Semiconductors LA12xx technology.
In a joint 6G AI proof-of-concept demonstration, the CMX500 one-box tester from Rohde & Schwarz shows significant downlink throughput gain in an AI-based wireless transmission compared to conventional non-AI technology.
Future Electronics and SnapMagic announced the launch of integrated SnapMagic CAD models across the Future Electronics global online catalog.
LitePoint, along with Aethertek and Metanoia, announced a three‑way collaboration to accelerate the development, validation and commercialization of next‑generation 5G FR2 O‑RUs.
Teledyne Microwave UK released its new wideband limiter, a passive 0.1 to 20 GHz RF protection module designed to enhance the survivability of R-ESM and wider EW systems operating in increasingly complex threat environments.
KRYTAR, Inc. announced a new 90-degree ULTRA+ Hybrid Coupler that deliver 3 dB of coupling over the frequency range of 2.0 to 18.0 GHz in a compact package.
At MWC Barcelona 2026, Rohde & Schwarz and Qualcomm Technologies, Inc. have reached another pivotal milestone in 6G research and ecosystem readiness, successfully demonstrating carrier aggregation across FR1 and FR3 frequency ranges.
Amphenol RF announced the expansion of their non-magnetic connector portfolio with additional SMPM connectors.
Keysight Technologies, Inc. and Samsung Electronics are collaborating to demonstrate an end-to-end AI-RAN testing and validation workflow with NVIDIA at Mobile World Congress 2026 in Barcelona.
At Mobile World Congress (MWC) 2026, Forefront RF what it believes to be the industry’s first commercially available tunable duplexer module, the FFM51010, implemented without SAW or BAW acoustic filtering.
Skyworks Solutions, Inc. announced it will showcase an early 6G new FR3 frequency range RF front-end (RFFE) power amplifier at Mobile World Congress 2026.
Recent independent teardown and technical analyses have confirmed that the 5G mmWave antenna module powering Apple’s latest iPhone 17, iPhone 17 Pro and iPhone 17 Pro Max relies on fully depleted silicon-on-insulator (FD-SOI) substrate technology.
Sivers Semiconductors AB announced its participation at MWC Barcelona, March 2–5, 2026.
Ericsson and Intel are pooling their next-generation technology leadership to help accelerate ecosystem readiness for seamless transition to AI-native 6G deployments and use cases.
Guerrilla RF, Inc. announced its expanded focus and readiness to support the rapidly evolving unmanned aerial systems (UAS) and counter-UAS (C-UAS) markets.
Viasat and Rohde & Schwarz are working together to strengthen and expand testing for non‑terrestrial network (NTN) capabilities, specifically for NB-IoT devices.
Siemens announced the Questa One Agentic Toolkit, which brings domain-scoped agentic AI workflows to its Questa™ One smart verification software portfolio.