UF 120LA: The Next-Generation High-Reliability, 100% Flux Residue Compatible and Reworkable Underfill
YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging.
YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging.
Samsung Electronics Co., Ltd. announced that UScellular has enhanced its 5G network capabilities in the Mid-Atlantic region with Samsung’s 5G solutions.
Following a roughly one-year test phase at Concourse A in Terminal 1, the German Federal Police have authorized the full-scale use of the Rohde & Schwarz QPS Walk2000 air travel security system.
The new Wi-SUN Alliance program will certify that products such as smart meters, smart sensors, communications modules and development kits are compliant with the field area network (FAN) 1.1 wireless mesh specification.
EnSilica announced that it has been awarded funding from the U.K. Space Agency under its Connectivity in Low-Earth Orbit (C-LEO) programme.
TagoreTech announced the appointment of Mark J. Lachiw as senior quality and supply chain manager.
Element Six (E6) will launch an innovative Cu-diamond product at Photonics West 2025.
Taoglas® announced a new family of active, multi-band GNSS antennas.
Rohde & Schwarz will showcase its comprehensive portfolio of test and measurement and industry solutions for the mobile ecosystem at Mobile World Congress 2025 at Fira Gran Via in Barcelona in hall 5, booth 5A80.
Nuvotronics has been selected by MDA Space Ltd. as part of the company’s supply chain for MDA AURORA™, a game-changing product line driving the transition from analog to digital satellite technology.
Sivers Semiconductors announced that it has signed a contract to develop high performance, low-cost digitizers based on the NXP Layerscape platform for satcom by Intelsat.
All SMT variants of the Aluminum Electrolyte and Aluminum Hybrid Polymer capacitors from Würth Elektronik are now available in an extremely vibration-resistant version on request.
With the SPECTRAN® V6 MOBILE devices, Aaronia is now launching a portable real-time spectrum analyzer series that enables precise and reliable on-site measurements.
According to a newly published report by Dell’Oro Group, the broadband access equipment market is forecasted to grow 0.8 percent on average for the next five years (2024-2029).
The U.S. Army has awarded L3Harris Technologies full-rate manpack and leader radio production orders under the Handheld, Manpack & Small Form Fit (HMS) program totaling nearly $300 million.
Pickering Group has opened a new office in Penang, Malaysia, to better serve the needs of its expanding customer base throughout the Southeast Asia region.
A new 5G network backbone for more advanced research initiatives and immersive learning platforms has been deployed at TH Rosenheim in Germany, thanks to a collaboration between Slovenia’s Kontron and Mugler SE.
Next-generation UHF band GaN solid state power amplifiers (SSPAs) developed by Celestia TTI will transmit UHF signals from space to terrestrial users when the SpainSat NG I launches from Cape Canaveral, Fla., on January 29, 2025.
PseudolithIC Inc announced it has successfully raised $6 million in a seed funding round to enable the company to accelerate the development and commercialization of hybrid semiconductor products which integrate compound semiconductor chiplets into silicon wafers.
Anritsu Company will showcase innovative high speed signal integrity solutions at DesignCon 2025, January 29-30 in Santa Clara, Calif., in booth #907, Exhibit Halls A-D.