Amphenol RF introduces the new RP-SMA bulkhead jack to AMC4 plug micro-miniature cable assembly into their portfolio of fixed-length cable assemblies. 

CML Micro expands its SµRF product portfolio with a pair of high efficiency single- and two-stage power amplifiers that offer outstanding performance for a wide range of dual-cell lithium battery-powered wireless devices.

Junkosha launched its new look for its third Technology Innovator of the Year Award. 

 According to 5G Americas and Omdia, 5G has expanded 4x faster than 4G LTE did in a comparable period, when LTE had just surpassed 500 million connections at the end of 2014.

EnSilica announced that it has been awarded an $18 million design and supply contract by a leading European based supplier of electromechanical products for a Cortex M series Arm-based mixed signal sensor interface ASIC.

ATIS’ Next G Alliance (NGA) announced the release of the 6G Component Technologies White Papers Series, four pieces that address critical technologies that will contribute to North American leadership in the 6G future.

Anywaves is now launching its first in-house production of space antennas and New Space payloads through its own pilot lines.

Siemens announced that it has completed the acquisition of Altair Engineering Inc.

Ericsson and Drei Austria are collaborating to enhance urban 5G connectivity by testing W-Band frequencies.

Leonardo DRS, Inc. introduced its high performance Artificial Intelligence Processor (AIP) latest computing system.

HSWERX selected MatrixSpace Radar to provide advanced air detection to support uncrewed aircraft systems (UAS) operations.

NTT Corporation, NTT DOCOMO, INC. and NEC Corporation announced that they demonstrated a real-time bidirectional wireless transmission in the mmWave band between 71 GHz and 86 GHz that achieved a bit rate of 140 gigabits per second.

Quantic Wenzel® has moved to a new 45,000-square-foot facility in Austin, Texas. 

Sivers Semiconductors AB announced a partnership with WIN Semiconductors to enhance production of Sivers Semiconductors’ proprietary high-power DFB lasers and laser arrays technology.

RANsemi announced that it is collaborating with ACES in a strategic Open RAN partnership.

SWISSto12 announces the release of HummingLink-Satcom-On-The-Pause (SOTP), a new type of terminal for GEO connectivity combines a small form factor, high portability, quick deployment and high throughput.

Insight SIP signs a distribution agreement with Master Electronics, a global electronics distributor with headquarters in Phoenix, Ariz., USA.

Raytheon has been awarded a follow-on contract from the U.S. Army Futures Command, Futures and Concepts Center to continue to utilize its Rapid Campaign Analysis and Demonstration Environment (RCADE) modeling and simulation capability.

Insulated Wire Inc. (IW) announced the availability of a new short form catalogue providing information on their market leading range of products.

Amphenol RF introduced the new SMA to SMA plug RG-188 cable assembly into their cable assembly portfolio.