MACOM Expands IC Design Expertise with Acquisition of ENGIN-IC
MACOM announced that it has acquired ENGIN-IC, Inc.
MACOM announced that it has acquired ENGIN-IC, Inc.
MACOM Technology Solutions Inc. announced that it has been selected to lead a development project to establish advanced GaN on SiC process technologies for RF and microwave applications.
RIGOL Technologies announced the latest additions to its portfolio of performance measurement equipment with the introduction of the DG5000 Pro Series Generators and DHO/MHO5000 Series Oscilloscopes.
Honeywell has been awarded a $16 million contract from the U.S. Navy for the full build, test and integration of 25 antenna array panels supporting the Surface Electronic Warfare Improvement Program (SEWIP) Block 2.
The Wireless Broadband Alliance (WBA) announced a new framework for integrating FIDO Device Onboard (FDO) and WBA OpenRoamingTM technologies.
Kymeta announced the launch of the Goshawk u8, a hybrid geostationary/low Earth orbit (GEO/LEO/cellular) terminal.
IDTechEx's recent report, "Advanced Semiconductor Packaging 2025-2035: Forecasts, Technologies, Applications," delves deep into understanding the technical aspects of packaging technologies, examining industry challenges, the progress made by leading companies and providing market forecasts for the sector.