Lane Electronics has increased their stockholding of HUBER+SUHNER products and can now offer over many hundreds of parts for fast delivery from their webshop.
ThinKom Solutions, Inc. and Boeing successfully demonstrated integration of the ThinAir® GT 2517 antenna with advanced modem hardware to deliver unrivaled network performance for government customers.
Blighter has unveiled BlighterNexus, an AI-assisted connectivity and processing hub.
Teledyne HiRel Semiconductors announces the availability of its latest rad-tolerant wideband 50 GHz RF switch, model TDSW050A2T.
Quantic MWD announced the launch of its new Whisper Series phase locked dielectric resonator oscillators (PLDROs).
According to a recent forecast report by Dell’Oro Group, mobile backhaul transport equipment for 5G networks is forecast to grow at a CAGR of 12 percent from 2024 through 2028 before declining the following year, when the attention shifts to 6G network upgrades.
YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging.
Samsung Electronics Co., Ltd. announced that UScellular has enhanced its 5G network capabilities in the Mid-Atlantic region with Samsung’s 5G solutions.
Following a roughly one-year test phase at Concourse A in Terminal 1, the German Federal Police have authorized the full-scale use of the Rohde & Schwarz QPS Walk2000 air travel security system.
The new Wi-SUN Alliance program will certify that products such as smart meters, smart sensors, communications modules and development kits are compliant with the field area network (FAN) 1.1 wireless mesh specification.
