Yole Group released its new "Semiconductor Trends in Automotive" report, 2024 edition, providing an in-depth understanding of the changing automotive industry ecosystem and supply chain.
Amphenol RF expands its TNC and RP-TNC portfolio with new cable-mount configurations designed for use with micro-coaxial cable types.
The combination of two smart home connectivity standards promises to unlock value-added services for network operators and broadband service providers (BSPs) and deliver on the potential of the smart home, Broadband Forum has announced.
ZTE Corporation has debuted the industry's first AI-powered full-stack FWA solution, the ZTE Nebula AI FWA Solution.
Taoglas introduces AntennaXpert, a suite of user-friendly, digital tools including the Taoglas Antenna Integrator, Antenna Builder and Cable Builder.
5G Americas announced the publication of its latest white paper, “The Programmable 5G Network and API Ecosystem,” highlighting the industry’s shift toward software-defined networks and the pivotal role of APIs in delivering scalable, secure and innovative services across sectors.
Teledyne announced that it has entered into an agreement to acquire select aerospace and defense electronics businesses from Excelitas Technologies Corp. for $710 million in cash.
Fairview Microwave has announced its latest offering: the Quartz Series of surface-mount failsafe electromechanical relay switches.
Anritsu Corporation announced full support for 5G and LTE Next Generation eCall (NGeCall) validated test cases on its 5G NR Mobile Device Test Platform ME7834NR. enabling GCF certification.
IDTechEx's new report, "Plug-in Hybrid and Battery Electric Cars 2025-2045: Technologies, Players, Regulations, Market Forecasts," reveals that just 1.4 percent more EVs (BEV and PHEV) were sold in H1 2024 than in H1 2023.
With New Radio Dual Connectivity (5G DC), T-Mobile was able to increase uplink throughput and capacity, reaching peak speeds of 2.2 Gbps.
MACOM announced that it has acquired ENGIN-IC, Inc.
MACOM Technology Solutions Inc. announced that it has been selected to lead a development project to establish advanced GaN on SiC process technologies for RF and microwave applications.
RIGOL Technologies announced the latest additions to its portfolio of performance measurement equipment with the introduction of the DG5000 Pro Series Generators and DHO/MHO5000 Series Oscilloscopes.
Honeywell has been awarded a $16 million contract from the U.S. Navy for the full build, test and integration of 25 antenna array panels supporting the Surface Electronic Warfare Improvement Program (SEWIP) Block 2.
The Wireless Broadband Alliance (WBA) announced a new framework for integrating FIDO Device Onboard (FDO) and WBA OpenRoamingTM technologies.
Kymeta announced the launch of the Goshawk u8, a hybrid geostationary/low Earth orbit (GEO/LEO/cellular) terminal.
IDTechEx's recent report, "Advanced Semiconductor Packaging 2025-2035: Forecasts, Technologies, Applications," delves deep into understanding the technical aspects of packaging technologies, examining industry challenges, the progress made by leading companies and providing market forecasts for the sector.
Keysight Technologies, Inc. and Analog Devices, Inc. have collaborated to create a comprehensive test solution for Gigabit Multimedia Serial Link (GMSL2TM) devices.
Pixus Technologies has announced that their RX410 ruggedized NI (Ettus Research brand) USRP software defined radios (SDRs) have passed military qualification testing.